HWA
Specifications
◇Sn/Pb thickness:2-25um
◇Sn/Pb proportion:63:37
◇Shelf life: 24 months
Characteristics:very good wetting ability Proven method

Electroless Gold
Specifications
◇Ni thickness:2.5-8um
◇Au thickness:0.05-0.12um
◇Shelf life:18 months
Characteristics：
smooth surface,Stability in soldering ,good wear ability in soldering

Electrolytic Ni/Au
Technical Data:
◇Ni thickness:2.5-6um
◇Au thickness:0.02-0.12um
Characteristics：
The surface of the Electrolytic Ni/Au is consistent and smooth,fits high density SMT and Bonding.

Clemical Sliver
Specifications:
◇he solderablity
◇Flat surface;good for applying BGA,7C,COB,
◇Can be used by press -fit techonlogy
◇Withstands very low temperatures
◇Good bonding ability◇Good conductivity◇Low cost

Impedance
Specifications:
◇Control resistance:50-100 omegas ◇Accuracy:＋/-10%
◇Testing Accuracy:500omega ,
100omega=1.5%
Characteristics：
Accures the transmission quality of high-frequency and speed signals

Plugged Vias
Specifications:
◇Hole diameter0.25-0.8um
◇Depth30%-100%
◇Material:LP2
Characteristics：Assured quality,protects BGA against shorts.

Peel-Away Glue
Specifications:
◇Peel thickness:0.3-0.6mm◇Re-solder ability:1-2 times
Characteristics：
Efficient in protecing soldering area

Blind&Buried vias、HDI Board
Process method:
Build-up technology
Characteristics：
Reduce electromagnetic and ratio frequency interference,perfect signal transmission